Wire saw

A wire (12) is wound around multiple processing rollers (11) several times. A holding mechanism (13) and a depressing mechanism (25) are provided above an area where the wire (12) is wound. The holding mechanism (13) holds a workpiece (W) elastically and laterally. The depressing mechanism (25) depr...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SHIMADA, HITOSHI, KAWATSU, TOMOYUKI, TANIZAKI, AKIRA, YABU, YOSUKE
Format: Patent
Sprache:chi ; eng
Schlagworte:
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Beschreibung
Zusammenfassung:A wire (12) is wound around multiple processing rollers (11) several times. A holding mechanism (13) and a depressing mechanism (25) are provided above an area where the wire (12) is wound. The holding mechanism (13) holds a workpiece (W) elastically and laterally. The depressing mechanism (25) depresses the workpiece (W) held by the holding mechanism (13) toward the wire (12).