Semiconductor package and method of attaching semiconductor dies to substrates

Semiconductor package and method of attaching semiconductor dies to substrates

A method of mounting a semiconductor die on a substrate with a solder mask on a first surface includes placing a die on the solder mask, and mounting the die to the substrate by applying pressure and heat. The applied pressure ranges from a bond force of approximately 5 to 10 kgf, the heat has a tem...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: CASTILLO, DENVER PAUL C, AMMER, FLORIAN, TAN, BRYAN SOON HUA, CHOW, SOO PIN, MANALAC, RODEL, ENG, KIAN TENG, ONG, PANG HUP, REISS, WERNER JOSEF, HETZEL, WOLFGANG JOHANNES
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A method of mounting a semiconductor die on a substrate with a solder mask on a first surface includes placing a die on the solder mask, and mounting the die to the substrate by applying pressure and heat. The applied pressure ranges from a bond force of approximately 5 to 10 kgf, the heat has a temperature range from approximately 150 to 200° C. and the pressure is applied for a range of approximately 1 to 10 seconds.