Curable resin composition, halogen-free resin substrate, and halogen-free build-up printed wiring board

In a curable resin composition containing an inorganic filler, the average particle diameter of the inorganic filler is 1 μm or less and the content of the inorganic filler is 50 wt % or less. The curable resin composition can be preferably used for a halogen-free resin substrate and the like having...

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Bibliographische Detailangaben
Hauptverfasser:	KITAMURA, KAZUNORI, KOGA, YUKIHIRO, SATO, KIYOSHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	In a curable resin composition containing an inorganic filler, the average particle diameter of the inorganic filler is 1 μm or less and the content of the inorganic filler is 50 wt % or less. The curable resin composition can be preferably used for a halogen-free resin substrate and the like having a small load on an environment as a hole-plugging curable resin composition as well as used to provide a hole-plugging build-up printed wiring board having a via-on-via structure (in particular, a stacked via structure) having an excellent crack-resistant property, an excellent insulation/connection reliability, and the like.