TWI395761B

Disclosed is an alkali-developable resin composition containing a fluorine-containing copolymer (E) which is obtained by modifying a part or all of hydroxyl groups in a block copolymer (C) with a polybasic acid anhydride (D). The block copolymer (C) is composed of a segment A which is a fluorine-con...

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Hauptverfasser: CHIBA, RYOTA, TSUZUKI, MASAHIDE
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creator CHIBA, RYOTA
TSUZUKI, MASAHIDE
description Disclosed is an alkali-developable resin composition containing a fluorine-containing copolymer (E) which is obtained by modifying a part or all of hydroxyl groups in a block copolymer (C) with a polybasic acid anhydride (D). The block copolymer (C) is composed of a segment A which is a fluorine-containing segment obtained from one or more fluorine monomers (A) and a segment B which is a fluorine-free segment obtained from one or more fluorine-free monomers (B), and the hydroxyl groups are contained in the segment A and/or the segment B. Also disclosed is an alkali-developable photosensitive resin composition containing such an alkali-developable resin composition containing a fluorine-containing copolymer. This alkali-developable photosensitive resin composition is excellent in ink repellency, alkali developability, sensitivity, resolution, transparency, adhesion and alkali resistance, and enables to form a fine pattern precisely.
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The block copolymer (C) is composed of a segment A which is a fluorine-containing segment obtained from one or more fluorine monomers (A) and a segment B which is a fluorine-free segment obtained from one or more fluorine-free monomers (B), and the hydroxyl groups are contained in the segment A and/or the segment B. Also disclosed is an alkali-developable photosensitive resin composition containing such an alkali-developable resin composition containing a fluorine-containing copolymer. This alkali-developable photosensitive resin composition is excellent in ink repellency, alkali developability, sensitivity, resolution, transparency, adhesion and alkali resistance, and enables to form a fine pattern precisely.</description><language>chi</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; APPARATUS SPECIALLY ADAPTED THEREFOR ; CHEMISTRY ; CINEMATOGRAPHY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; DYES ; ELECTROGRAPHY ; HOLOGRAPHY ; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS ; MATERIALS THEREFOR ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; ORGANIC MACROMOLECULAR COMPOUNDS ; ORIGINALS THEREFOR ; PAINTS ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; POLISHES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2013</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20130511&amp;DB=EPODOC&amp;CC=TW&amp;NR=I395761B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20130511&amp;DB=EPODOC&amp;CC=TW&amp;NR=I395761B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHIBA, RYOTA</creatorcontrib><creatorcontrib>TSUZUKI, MASAHIDE</creatorcontrib><title>TWI395761B</title><description>Disclosed is an alkali-developable resin composition containing a fluorine-containing copolymer (E) which is obtained by modifying a part or all of hydroxyl groups in a block copolymer (C) with a polybasic acid anhydride (D). 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subjects ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
APPARATUS SPECIALLY ADAPTED THEREFOR
CHEMISTRY
CINEMATOGRAPHY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
DYES
ELECTROGRAPHY
HOLOGRAPHY
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS
MATERIALS THEREFOR
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
ORGANIC MACROMOLECULAR COMPOUNDS
ORIGINALS THEREFOR
PAINTS
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
POLISHES
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF MATERIALS AS ADHESIVES
title TWI395761B
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