A two layer film, a method of manufacturing a two layer film, and a method of manufacturing a printed circuit board

The subject of the present invention provides a two-layer film including a polymer layer and a metal layer, in which its metal layer has a sufficient bonding strength even if they are applied to high-density wiring, a method for manufacturing the same, and a manufacturing method of printed circuit b...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	OHNISHI, KAZUMI, KAWAGUCHI, HIROYUKI, AKATSU, MASAMICHI, BABA, TOMOHIRO, SAINO, KUNIHIKO, TAMADA, NORIO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	The subject of the present invention provides a two-layer film including a polymer layer and a metal layer, in which its metal layer has a sufficient bonding strength even if they are applied to high-density wiring, a method for manufacturing the same, and a manufacturing method of printed circuit board using the same. The solution of the present invention is a two-layer film including a polymer film 10 and a first metal film 12 formed on the polymer film and containing nickel at the 60 to 100 weight percent and nitrogen atoms; and a second metal film 14 having a main content of copper and formed on the first metal film. The manufacturing method of the two-layer film includes a step that forms the first metal film at the 60 to 100 weight percent on the polymer film by a vacuum evaporation, ion plating or sputtering method under a nitrogen-containing environment, and a step that forms the second metal film having a main content of copper on the first metal film.