TWI373537B

PURPOSE: To provide a plating apparatus and a plating method capable of substantially restraining infiltration of impurities from anode chamber to cathode chamber, maintaining stable supply of anode metals and extending a period requiring management operation, thereby substantially improving product...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	OBATA, SOUICHI, KAMEYAMA, YUUICHI
Format:	Patent
Sprache:	chi
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!