TWI373537B

PURPOSE: To provide a plating apparatus and a plating method capable of substantially restraining infiltration of impurities from anode chamber to cathode chamber, maintaining stable supply of anode metals and extending a period requiring management operation, thereby substantially improving productivity. CONSTITUTION: In a plating apparatus(10) comprising sealed anode chamber structures(20L,20R) which are mounted on both sides of the plating pot in a width direction of a plating pot(11), in which a face directed to the center in the plating pot is formed of a fabric member(26), and which form sealed anode chambers(24) as a whole; and anode units(21L,21R) consisting of anodes(22) contained in the respective sealed anode chamber structures, and a surrounding member(23) formed of a fabric material to surround the anodes, the plating apparatus further comprises a plating solution extraction supply means(50) installed in the respective anode chambers to supply the plating solution to other places by extracting pl