TWI373537B

PURPOSE: To provide a plating apparatus and a plating method capable of substantially restraining infiltration of impurities from anode chamber to cathode chamber, maintaining stable supply of anode metals and extending a period requiring management operation, thereby substantially improving product...

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Hauptverfasser:	OBATA, SOUICHI, KAMEYAMA, YUUICHI
Format:	Patent
Sprache:	chi
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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creator	OBATA, SOUICHI KAMEYAMA, YUUICHI
description	PURPOSE: To provide a plating apparatus and a plating method capable of substantially restraining infiltration of impurities from anode chamber to cathode chamber, maintaining stable supply of anode metals and extending a period requiring management operation, thereby substantially improving productivity. CONSTITUTION: In a plating apparatus(10) comprising sealed anode chamber structures(20L,20R) which are mounted on both sides of the plating pot in a width direction of a plating pot(11), in which a face directed to the center in the plating pot is formed of a fabric member(26), and which form sealed anode chambers(24) as a whole; and anode units(21L,21R) consisting of anodes(22) contained in the respective sealed anode chamber structures, and a surrounding member(23) formed of a fabric material to surround the anodes, the plating apparatus further comprises a plating solution extraction supply means(50) installed in the respective anode chambers to supply the plating solution to other places by extracting pl
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fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TWI373537BB</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TWI373537BB</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TWI373537BB3</originalsourceid><addsrcrecordid>eNrjZOAKCfc0Njc2NTZ34mFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8QgNTsZEKAEACxQbhQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>TWI373537B</title><source>esp@cenet</source><creator>OBATA, SOUICHI ; KAMEYAMA, YUUICHI</creator><creatorcontrib>OBATA, SOUICHI ; KAMEYAMA, YUUICHI</creatorcontrib><description>PURPOSE: To provide a plating apparatus and a plating method capable of substantially restraining infiltration of impurities from anode chamber to cathode chamber, maintaining stable supply of anode metals and extending a period requiring management operation, thereby substantially improving productivity. CONSTITUTION: In a plating apparatus(10) comprising sealed anode chamber structures(20L,20R) which are mounted on both sides of the plating pot in a width direction of a plating pot(11), in which a face directed to the center in the plating pot is formed of a fabric member(26), and which form sealed anode chambers(24) as a whole; and anode units(21L,21R) consisting of anodes(22) contained in the respective sealed anode chamber structures, and a surrounding member(23) formed of a fabric material to surround the anodes, the plating apparatus further comprises a plating solution extraction supply means(50) installed in the respective anode chambers to supply the plating solution to other places by extracting pl</description><language>chi</language><subject>APPARATUS THEREFOR ; CHEMISTRY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; METALLURGY ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><creationdate>2012</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20121001&DB=EPODOC&CC=TW&NR=I373537B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20121001&DB=EPODOC&CC=TW&NR=I373537B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>OBATA, SOUICHI</creatorcontrib><creatorcontrib>KAMEYAMA, YUUICHI</creatorcontrib><title>TWI373537B</title><description>PURPOSE: To provide a plating apparatus and a plating method capable of substantially restraining infiltration of impurities from anode chamber to cathode chamber, maintaining stable supply of anode metals and extending a period requiring management operation, thereby substantially improving productivity. CONSTITUTION: In a plating apparatus(10) comprising sealed anode chamber structures(20L,20R) which are mounted on both sides of the plating pot in a width direction of a plating pot(11), in which a face directed to the center in the plating pot is formed of a fabric member(26), and which form sealed anode chambers(24) as a whole; and anode units(21L,21R) consisting of anodes(22) contained in the respective sealed anode chamber structures, and a surrounding member(23) formed of a fabric material to surround the anodes, the plating apparatus further comprises a plating solution extraction supply means(50) installed in the respective anode chambers to supply the plating solution to other places by extracting pl</description><subject>APPARATUS THEREFOR</subject><subject>CHEMISTRY</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>METALLURGY</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2012</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOAKCfc0Njc2NTZ34mFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8QgNTsZEKAEACxQbhQ</recordid><startdate>20121001</startdate><enddate>20121001</enddate><creator>OBATA, SOUICHI</creator><creator>KAMEYAMA, YUUICHI</creator><scope>EVB</scope></search><sort><creationdate>20121001</creationdate><title>TWI373537B</title><author>OBATA, SOUICHI ; KAMEYAMA, YUUICHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TWI373537BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi</language><creationdate>2012</creationdate><topic>APPARATUS THEREFOR</topic><topic>CHEMISTRY</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>METALLURGY</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><toplevel>online_resources</toplevel><creatorcontrib>OBATA, SOUICHI</creatorcontrib><creatorcontrib>KAMEYAMA, YUUICHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>OBATA, SOUICHI</au><au>KAMEYAMA, YUUICHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>TWI373537B</title><date>2012-10-01</date><risdate>2012</risdate><abstract>PURPOSE: To provide a plating apparatus and a plating method capable of substantially restraining infiltration of impurities from anode chamber to cathode chamber, maintaining stable supply of anode metals and extending a period requiring management operation, thereby substantially improving productivity. CONSTITUTION: In a plating apparatus(10) comprising sealed anode chamber structures(20L,20R) which are mounted on both sides of the plating pot in a width direction of a plating pot(11), in which a face directed to the center in the plating pot is formed of a fabric member(26), and which form sealed anode chambers(24) as a whole; and anode units(21L,21R) consisting of anodes(22) contained in the respective sealed anode chamber structures, and a surrounding member(23) formed of a fabric material to surround the anodes, the plating apparatus further comprises a plating solution extraction supply means(50) installed in the respective anode chambers to supply the plating solution to other places by extracting pl</abstract><oa>free_for_read</oa></addata></record>
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subjects	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
title	TWI373537B
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-19T07%3A17%3A10IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=OBATA,%20SOUICHI&rft.date=2012-10-01&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETWI373537BB%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true