Bonding method and apparatus

PROBLEM TO BE SOLVED: To provide a bonding method and its device for effectively mounting a mounting member on a substrate. SOLUTION: A plurality of aligned chips 4 are pressed with a head 12 from the upper portion of an elastic member 6 which is interposed between these chips 4 and the head 12 to cover the chips 4. The elastic member 6 uniformly pressurizes the chips by absorbing variations of the thickness thereof for every chip 4, and infrared rays emitted and focused from an infrared ray irradiation part 8 located below the substrate 2 irradiate only the rear surface of the substrate 2 on which the chip 4 is mounted, to heat and cure the resin of the substrate. It is therefore possible to simultaneously mount the plurality of the chips 4 on the substrate 2 and to avoid thermal stress which might be otherwise exerted on the entire substrate. COPYRIGHT: (C)2005,JPO&NCIPI