Zigzag-stacked chip package structure with lead-fr

The present invention provides a zigzag-stacked chip package structure with lead-frame having inner leads with transfer pad, comprising: a lead-frame composed of a plurality of group of inner leads arranged oppositely, a plurality of group of outer leads, and a die pad, wherein the die pad is disposed among the plurality of group of inner leads arranged oppositely, and a height difference is formed between the die pad and the plurality of group of inner leads arranged oppositely; a zigzag stacked-chip packaging structure formed with a plurality of chips stacked together, the zigzag stacked-chip packaging structure being fixedly connected onto the die pad and electronically connected with the group of inner leads arranged oppositely; and an encapsulant encapsulating the offset stacked-chip packaging structure and the lead-frame and allowing the plurality of outer leads to extend out of said encapsulant; the improvement of which is that the inner leads in the lead-frame are coated with an insulating layer and a