Pad configuration of die and manufacturing method thereof

Pad configuration of die and manufacturing method thereof

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Hauptverfasser: TU, WEN CHIEH, CHENG, PAI SHENG, LEE, CHUAN CHE, HUANG, GUAN SHENG
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator TU, WEN CHIEH
CHENG, PAI SHENG
LEE, CHUAN CHE
HUANG, GUAN SHENG
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Pad configuration of die and manufacturing method thereof
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