Multi-row lead frame

A lead frame ( 10 ) for a semiconductor device includes a first row of terminals ( 12 ) surrounding a die receiving area ( 14 ) and a second row of terminals ( 16 ) spaced from and surrounding the first row of terminals ( 12 ). The first and second rows of terminals ( 12, 16 ) have a first height (H1). The terminals ( 12 ) of the first row include a step ( 26 ) that has a greater height (H2). Bond wires ( 36 ) connecting die pads ( 34 ) to the first row terminals ( 12 ) extend over the second height H2 part of the terminal ( 12 ) and are attached to the first height H1 part of the terminal ( 12 ). The step ( 26 ) insures that the bond wires ( 36 ) attached to the stepped terminals ( 12 ) have a high wire kink profile so that they are less susceptible to damage in later process steps.