Method for preparing light emitting diode device having heat dissipation rate enhancement

An LED device and a method for manufacturing the same are provided to easily separate substrates by using two adhesives with different viscosity each other. A light emitting diode part grown on a sapphire substrate is bonded with a first surface of a first substrate by using a first adhesive. A seco...

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Bibliographische Detailangaben
Hauptverfasser:	CHANG, SUK KY, YU, MIN A, KHO, DONG HAN, PARK, SOO MIN, SHIN, BU GON, KANG, JONG HOON, CHUN, SANG KI, LEE, JAE SEUNG, CHOI, MIN HO, HA, DUK SIK
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	An LED device and a method for manufacturing the same are provided to easily separate substrates by using two adhesives with different viscosity each other. A light emitting diode part grown on a sapphire substrate is bonded with a first surface of a first substrate by using a first adhesive. A second surface of the first substrate is bonded with a first surface of a second substrate by using a second adhesive having a relatively low viscosity compared to the first adhesive. The second surface of the sapphire substrate is processed, and the second substrate is discrete. The resultant structure is discrete into a unit chip. The processed second surface of the sapphire substrate is connected to a lead frame, and the first substrate is discrete.