Slurry for mechanical polishing (cmp) of metals and use thereof
PURPOSE: Slurry compositions that are useful for polishing or planarizing a surface are provided, and polishing processes employing the compositions are provided. CONSTITUTION: The slurry composition comprises about 0.5 to about 6% by weight of the abrasive particles, about 1 to 50 g/l of the oxidiz...
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| creator | LOFARO, MICHAEL FRANCIS HANNAH, JAMES WILLARD COTE, WILLIAM TORNELLO, JAMES ANTHONY DAVIS, KENNETH MORGAN WHITE, ERIC JEFFREY COBB, MICHAEL ADDITION SCHAFFER, DEAN ALLEN ESTES, SCOTT ALAN KRISHNAN, MAHADEVAIYER SLUSSER, GEORGE JAMES CANAPERI, DONALD FRANCIS BRIGHAM, MICHAEL TODD GORDON, EDWARD JACK MACDONALD, MICHAEL JOSEPH |
| description | PURPOSE: Slurry compositions that are useful for polishing or planarizing a surface are provided, and polishing processes employing the compositions are provided. CONSTITUTION: The slurry composition comprises about 0.5 to about 6% by weight of the abrasive particles, about 1 to 50 g/l of the oxidizer, about 0.1 to about 100 ml/l of the surface active agent, about 0.001 to about 20 g/l of the chloride ion source, and about 0.001 to about 20 g/l of the sulfate ion source. The method for polishing a surface comprises the steps of providing on the surface a slurry composition comprising abrasive particles, an oxidizer, a surface active agent, a chloride ion source and a sulfate ion source; and polishing the surface by contacting it with a polishing pad, wherein the surface is selected from the group consisting of copper, aluminum, tungsten, and their alloys. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TWI306895BB</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TWI306895BB</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TWI306895BB3</originalsourceid><addsrcrecordid>eNrjZLAPziktKqpUSMsvUshNTc5IzMtMTsxRKMjPySzOyMxLV9BIzi3QVMhPA8qWJOYUKyTmpSiUFqcqlGSkFqXmp_EwsKYBhVN5oTQ3g4Kba4izh25qQX58anFBYnJqXmpJfEi4p7GBmYWlqZOTMRFKAP9ZMHE</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Slurry for mechanical polishing (cmp) of metals and use thereof</title><source>esp@cenet</source><creator>LOFARO, MICHAEL FRANCIS ; HANNAH, JAMES WILLARD ; COTE, WILLIAM ; TORNELLO, JAMES ANTHONY ; DAVIS, KENNETH MORGAN ; WHITE, ERIC JEFFREY ; COBB, MICHAEL ADDITION ; SCHAFFER, DEAN ALLEN ; ESTES, SCOTT ALAN ; KRISHNAN, MAHADEVAIYER ; SLUSSER, GEORGE JAMES ; CANAPERI, DONALD FRANCIS ; BRIGHAM, MICHAEL TODD ; GORDON, EDWARD JACK ; MACDONALD, MICHAEL JOSEPH</creator><creatorcontrib>LOFARO, MICHAEL FRANCIS ; HANNAH, JAMES WILLARD ; COTE, WILLIAM ; TORNELLO, JAMES ANTHONY ; DAVIS, KENNETH MORGAN ; WHITE, ERIC JEFFREY ; COBB, MICHAEL ADDITION ; SCHAFFER, DEAN ALLEN ; ESTES, SCOTT ALAN ; KRISHNAN, MAHADEVAIYER ; SLUSSER, GEORGE JAMES ; CANAPERI, DONALD FRANCIS ; BRIGHAM, MICHAEL TODD ; GORDON, EDWARD JACK ; MACDONALD, MICHAEL JOSEPH</creatorcontrib><description>PURPOSE: Slurry compositions that are useful for polishing or planarizing a surface are provided, and polishing processes employing the compositions are provided. CONSTITUTION: The slurry composition comprises about 0.5 to about 6% by weight of the abrasive particles, about 1 to 50 g/l of the oxidizer, about 0.1 to about 100 ml/l of the surface active agent, about 0.001 to about 20 g/l of the chloride ion source, and about 0.001 to about 20 g/l of the sulfate ion source. The method for polishing a surface comprises the steps of providing on the surface a slurry composition comprising abrasive particles, an oxidizer, a surface active agent, a chloride ion source and a sulfate ion source; and polishing the surface by contacting it with a polishing pad, wherein the surface is selected from the group consisting of copper, aluminum, tungsten, and their alloys.</description><language>chi ; eng</language><subject>ADHESIVES ; ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES ; BASIC ELECTRIC ELEMENTS ; CANDLES ; CHEMISTRY ; DETERGENT COMPOSITIONS ; DETERGENTS ; DYES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FATTY ACIDS THEREFROM ; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; PAINTS ; POLISHES ; POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH ; RECOVERY OF GLYCEROL ; RESIN SOAPS ; SEMICONDUCTOR DEVICES ; SKI WAXES ; SOAP OR SOAP-MAKING ; USE OF SINGLE SUBSTANCES AS DETERGENTS</subject><creationdate>2009</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20090301&DB=EPODOC&CC=TW&NR=I306895B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20090301&DB=EPODOC&CC=TW&NR=I306895B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LOFARO, MICHAEL FRANCIS</creatorcontrib><creatorcontrib>HANNAH, JAMES WILLARD</creatorcontrib><creatorcontrib>COTE, WILLIAM</creatorcontrib><creatorcontrib>TORNELLO, JAMES ANTHONY</creatorcontrib><creatorcontrib>DAVIS, KENNETH MORGAN</creatorcontrib><creatorcontrib>WHITE, ERIC JEFFREY</creatorcontrib><creatorcontrib>COBB, MICHAEL ADDITION</creatorcontrib><creatorcontrib>SCHAFFER, DEAN ALLEN</creatorcontrib><creatorcontrib>ESTES, SCOTT ALAN</creatorcontrib><creatorcontrib>KRISHNAN, MAHADEVAIYER</creatorcontrib><creatorcontrib>SLUSSER, GEORGE JAMES</creatorcontrib><creatorcontrib>CANAPERI, DONALD FRANCIS</creatorcontrib><creatorcontrib>BRIGHAM, MICHAEL TODD</creatorcontrib><creatorcontrib>GORDON, EDWARD JACK</creatorcontrib><creatorcontrib>MACDONALD, MICHAEL JOSEPH</creatorcontrib><title>Slurry for mechanical polishing (cmp) of metals and use thereof</title><description>PURPOSE: Slurry compositions that are useful for polishing or planarizing a surface are provided, and polishing processes employing the compositions are provided. CONSTITUTION: The slurry composition comprises about 0.5 to about 6% by weight of the abrasive particles, about 1 to 50 g/l of the oxidizer, about 0.1 to about 100 ml/l of the surface active agent, about 0.001 to about 20 g/l of the chloride ion source, and about 0.001 to about 20 g/l of the sulfate ion source. The method for polishing a surface comprises the steps of providing on the surface a slurry composition comprising abrasive particles, an oxidizer, a surface active agent, a chloride ion source and a sulfate ion source; and polishing the surface by contacting it with a polishing pad, wherein the surface is selected from the group consisting of copper, aluminum, tungsten, and their alloys.</description><subject>ADHESIVES</subject><subject>ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CANDLES</subject><subject>CHEMISTRY</subject><subject>DETERGENT COMPOSITIONS</subject><subject>DETERGENTS</subject><subject>DYES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FATTY ACIDS THEREFROM</subject><subject>MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH</subject><subject>RECOVERY OF GLYCEROL</subject><subject>RESIN SOAPS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SKI WAXES</subject><subject>SOAP OR SOAP-MAKING</subject><subject>USE OF SINGLE SUBSTANCES AS DETERGENTS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2009</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLAPziktKqpUSMsvUshNTc5IzMtMTsxRKMjPySzOyMxLV9BIzi3QVMhPA8qWJOYUKyTmpSiUFqcqlGSkFqXmp_EwsKYBhVN5oTQ3g4Kba4izh25qQX58anFBYnJqXmpJfEi4p7GBmYWlqZOTMRFKAP9ZMHE</recordid><startdate>20090301</startdate><enddate>20090301</enddate><creator>LOFARO, MICHAEL FRANCIS</creator><creator>HANNAH, JAMES WILLARD</creator><creator>COTE, WILLIAM</creator><creator>TORNELLO, JAMES ANTHONY</creator><creator>DAVIS, KENNETH MORGAN</creator><creator>WHITE, ERIC JEFFREY</creator><creator>COBB, MICHAEL ADDITION</creator><creator>SCHAFFER, DEAN ALLEN</creator><creator>ESTES, SCOTT ALAN</creator><creator>KRISHNAN, MAHADEVAIYER</creator><creator>SLUSSER, GEORGE JAMES</creator><creator>CANAPERI, DONALD FRANCIS</creator><creator>BRIGHAM, MICHAEL TODD</creator><creator>GORDON, EDWARD JACK</creator><creator>MACDONALD, MICHAEL JOSEPH</creator><scope>EVB</scope></search><sort><creationdate>20090301</creationdate><title>Slurry for mechanical polishing (cmp) of metals and use thereof</title><author>LOFARO, MICHAEL FRANCIS ; HANNAH, JAMES WILLARD ; COTE, WILLIAM ; TORNELLO, JAMES ANTHONY ; DAVIS, KENNETH MORGAN ; WHITE, ERIC JEFFREY ; COBB, MICHAEL ADDITION ; SCHAFFER, DEAN ALLEN ; ESTES, SCOTT ALAN ; KRISHNAN, MAHADEVAIYER ; SLUSSER, GEORGE JAMES ; CANAPERI, DONALD FRANCIS ; BRIGHAM, MICHAEL TODD ; GORDON, EDWARD JACK ; MACDONALD, MICHAEL JOSEPH</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TWI306895BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2009</creationdate><topic>ADHESIVES</topic><topic>ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CANDLES</topic><topic>CHEMISTRY</topic><topic>DETERGENT COMPOSITIONS</topic><topic>DETERGENTS</topic><topic>DYES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FATTY ACIDS THEREFROM</topic><topic>MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH</topic><topic>RECOVERY OF GLYCEROL</topic><topic>RESIN SOAPS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SKI WAXES</topic><topic>SOAP OR SOAP-MAKING</topic><topic>USE OF SINGLE SUBSTANCES AS DETERGENTS</topic><toplevel>online_resources</toplevel><creatorcontrib>LOFARO, MICHAEL FRANCIS</creatorcontrib><creatorcontrib>HANNAH, JAMES WILLARD</creatorcontrib><creatorcontrib>COTE, WILLIAM</creatorcontrib><creatorcontrib>TORNELLO, JAMES ANTHONY</creatorcontrib><creatorcontrib>DAVIS, KENNETH MORGAN</creatorcontrib><creatorcontrib>WHITE, ERIC JEFFREY</creatorcontrib><creatorcontrib>COBB, MICHAEL ADDITION</creatorcontrib><creatorcontrib>SCHAFFER, DEAN ALLEN</creatorcontrib><creatorcontrib>ESTES, SCOTT ALAN</creatorcontrib><creatorcontrib>KRISHNAN, MAHADEVAIYER</creatorcontrib><creatorcontrib>SLUSSER, GEORGE JAMES</creatorcontrib><creatorcontrib>CANAPERI, DONALD FRANCIS</creatorcontrib><creatorcontrib>BRIGHAM, MICHAEL TODD</creatorcontrib><creatorcontrib>GORDON, EDWARD JACK</creatorcontrib><creatorcontrib>MACDONALD, MICHAEL JOSEPH</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LOFARO, MICHAEL FRANCIS</au><au>HANNAH, JAMES WILLARD</au><au>COTE, WILLIAM</au><au>TORNELLO, JAMES ANTHONY</au><au>DAVIS, KENNETH MORGAN</au><au>WHITE, ERIC JEFFREY</au><au>COBB, MICHAEL ADDITION</au><au>SCHAFFER, DEAN ALLEN</au><au>ESTES, SCOTT ALAN</au><au>KRISHNAN, MAHADEVAIYER</au><au>SLUSSER, GEORGE JAMES</au><au>CANAPERI, DONALD FRANCIS</au><au>BRIGHAM, MICHAEL TODD</au><au>GORDON, EDWARD JACK</au><au>MACDONALD, MICHAEL JOSEPH</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Slurry for mechanical polishing (cmp) of metals and use thereof</title><date>2009-03-01</date><risdate>2009</risdate><abstract>PURPOSE: Slurry compositions that are useful for polishing or planarizing a surface are provided, and polishing processes employing the compositions are provided. CONSTITUTION: The slurry composition comprises about 0.5 to about 6% by weight of the abrasive particles, about 1 to 50 g/l of the oxidizer, about 0.1 to about 100 ml/l of the surface active agent, about 0.001 to about 20 g/l of the chloride ion source, and about 0.001 to about 20 g/l of the sulfate ion source. The method for polishing a surface comprises the steps of providing on the surface a slurry composition comprising abrasive particles, an oxidizer, a surface active agent, a chloride ion source and a sulfate ion source; and polishing the surface by contacting it with a polishing pad, wherein the surface is selected from the group consisting of copper, aluminum, tungsten, and their alloys.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVES ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES BASIC ELECTRIC ELEMENTS CANDLES CHEMISTRY DETERGENT COMPOSITIONS DETERGENTS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FATTY ACIDS THEREFROM MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS POLISHES POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH RECOVERY OF GLYCEROL RESIN SOAPS SEMICONDUCTOR DEVICES SKI WAXES SOAP OR SOAP-MAKING USE OF SINGLE SUBSTANCES AS DETERGENTS |
| title | Slurry for mechanical polishing (cmp) of metals and use thereof |
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