Slurry for mechanical polishing (cmp) of metals and use thereof

PURPOSE: Slurry compositions that are useful for polishing or planarizing a surface are provided, and polishing processes employing the compositions are provided. CONSTITUTION: The slurry composition comprises about 0.5 to about 6% by weight of the abrasive particles, about 1 to 50 g/l of the oxidizer, about 0.1 to about 100 ml/l of the surface active agent, about 0.001 to about 20 g/l of the chloride ion source, and about 0.001 to about 20 g/l of the sulfate ion source. The method for polishing a surface comprises the steps of providing on the surface a slurry composition comprising abrasive particles, an oxidizer, a surface active agent, a chloride ion source and a sulfate ion source; and polishing the surface by contacting it with a polishing pad, wherein the surface is selected from the group consisting of copper, aluminum, tungsten, and their alloys.