Light emitting apparatus and fabricated method thereof

A soft solder flows into a fillister of a semiconductor film of light emitting diode, while the film of light emitting diode connecting a new carrier provides (a) enhanced connection strength and better mechanism strength, (b) improved heat sink and (c) enhanced efficiency of extractible light. Island absorbing metal in the thermal treating area generates an ohm contact. The afore-mentioned isolated island connects the interior through a high reflection metal. The design makes the absorbance inside the light emitting diode slow down and result in apparent improvement in the efficiency of extractible light. Besides, efficiency of extractible light of an isotropy radiating device can be increased through the two-dimensional micro lens and the shape of device surface with photon energy level structure. Based on the reason of production, the surface micro lens is manufactured during the last step, preferably on the way of optical development.