Heat conducting structure of heat radiator

This invention relates to a heat conducting structure of heat radiator. It is applied for a heat dissipation module of an electronic apparatus to combine with a heating element. The structure comprises a heat conducting board, and a buckling spring. A plane of the heat conducting board combines with the heating element has at least one retaining ring cylinder and at least one keyhole cylinder. A pair of plates and a pair of structural plates combines the buckling spring. The plate has an aperture corresponding to the retaining ring cylinder. Furthermore, it has a locking aperture corresponding to the keyhole cylinder. Through the retaining ring and the keyhole cylinder, the heat conducting board supports a buckling spring. Moreover, the heating element is clipped through the buckling spring fastened and locked to the retaining ring cylinders and the keyhole cylinders. Eventually, the heating surface of the heating element is combined with the heat conducting board.