Micro electronic device and fabrication method thereof

Micro electronic device and fabrication method thereof

A method comprises providing a substrate having an active layer, forming an isolation trench in the active layer, and forming at least one bumper substantially filling at least one divot formed at an interface between the active layer and the isolation trench during isolation trench formation.

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Bibliographische Detailangaben
1. Verfasser: LEE, WENIN
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A method comprises providing a substrate having an active layer, forming an isolation trench in the active layer, and forming at least one bumper substantially filling at least one divot formed at an interface between the active layer and the isolation trench during isolation trench formation.