Heat dissipation apparatus and manufacturing method thereof

A heat dissipation apparatus, vapor chamber, applied to an electric device giving out heat, includes a tube, working fluid, evaporator, condenser, and at least one micro-groove. The evaporator, condenser, and the micro-grooves are formed on the inner wall of the tube by laser cutting, precision proc...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	CHEN, YEN-CY, WANG, HORNG-JOU, LIN, CHI-FENG, CHEN, CHIN-MING, TSAI, HSINANG
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT HEATING LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PRINTED CIRCUITS SEMICONDUCTOR DEVICES WEAPONS
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Beschreibung
Zusammenfassung:	A heat dissipation apparatus, vapor chamber, applied to an electric device giving out heat, includes a tube, working fluid, evaporator, condenser, and at least one micro-groove. The evaporator, condenser, and the micro-grooves are formed on the inner wall of the tube by laser cutting, precision process or micro-mold pattern method to press the substrate, the inner wall of the tube, and shaping the substrate to form the tube. Working fluid absorbs heat from the electric device and evaporates in the evaporator, and the evaporated working fluid condenses becoming liquid state in the condenser, and flow back to the evaporator by capillarity of the micro-grooves.