LOC (lead-on-chip) IC package

LOC (lead-on-chip) IC package

An IC package mainly includes a chip, a plurality of bumps, a leadframe with a plurality of leads, at least a die-bonding tape and an encapsulant. The die-bonding tape is an ACF (anisotropic conductive film) strip so as to enhance the adhesion and electrical connection between the leads of leadframe...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: LIU, LIUNG, CHOU, SHIH-WEN, CHEN, TING-YUAN, TU, WUANG, CHEN, YU-HSIN
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:An IC package mainly includes a chip, a plurality of bumps, a leadframe with a plurality of leads, at least a die-bonding tape and an encapsulant. The die-bonding tape is an ACF (anisotropic conductive film) strip so as to enhance the adhesion and electrical connection between the leads of leadframe and the chip. Accordingly, it can solve defects including wire-sweeping and wire-exposed caused by conventional connection of wire-bonding.