Package device with electromagnetic interference shield

The present invention provides a package device with electromagnetic interference shield, which includes a substrate that has a shield structure on the bottom surface of the substrate, and an insulating layer on the shield structure. The substrate having a through hole and the conductive material is filled with the through hole. A plurality of lead-frames located on the bottom surface of the substrate. A second substrate located on the portion of two lead-frames. Then, the molding compound is encapsulated over the above structures to form a package device. Therefore, the shield path of the package device is constructed of the plurality of lead-frames, the conductive material within the substrate, the shielding structure, and the grounded to release and reduce the electromagnetic/radio frequency interference for the package device.