Front-sucking type wafer-capturing arm
The present invention provides a front-sucking type wafer-capturing arm, which is applied in a transporting equipment of semiconductor wafer, wherein the principle of vacuum sucking and air-inlet pressure control is utilized to achieve the function of sucking wafer with no contact. Also, the chamber...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | The present invention provides a front-sucking type wafer-capturing arm, which is applied in a transporting equipment of semiconductor wafer, wherein the principle of vacuum sucking and air-inlet pressure control is utilized to achieve the function of sucking wafer with no contact. Also, the chamber pressure formed by the sucked wafer and the capturing arm is controlled by the air-inlet, thereby preventing the wafer from damage due to contamination. |
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