Connection material and connection structure body

The invention prevents a connection structure which is made of a connection material suitable for use when a semiconductor device is mounted on a circuit board for a semiconductor device from reducing connection reliability, even when the connection structure is put into a reflow furnace at about 24...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SHINOZAKI, JUNJI, TAKEICHI, MOTOHIDE
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The invention prevents a connection structure which is made of a connection material suitable for use when a semiconductor device is mounted on a circuit board for a semiconductor device from reducing connection reliability, even when the connection structure is put into a reflow furnace at about 240 DEG C regardless of whether the connection material is moistured or not while the connection structure is stored. The connection material suitable for use when the semiconductor device is mounted on the circuit board for the semiconductor device contains the following components: (A) epoxy resin; (B) phenol-based compound having two or more phenolic hydroxyl groups; and (C) latent curing agent. Preferably, the ratio of the equivalent weight of the phenol-based compound having two or more phenolic hydroxyl groups to the epoxy equivalent weight of the epoxy resin in the connection material is 0.2 to 1.0.