PCB drill method

The present invention is a PCB drill method. The method comprises providing a core layer comprises the copper foil circuit and the aimed point formed on the core layer, a dielectric film formed on the core layer, the copper layer formed on the dielectric film. The method further comprises removing t...

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Bibliographische Detailangaben
1. Verfasser:	HSU, HUNG-EN
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	The present invention is a PCB drill method. The method comprises providing a core layer comprises the copper foil circuit and the aimed point formed on the core layer, a dielectric film formed on the core layer, the copper layer formed on the dielectric film. The method further comprises removing the copper layer, providing a light illuminates to find out the aimed point and the copper foil circuit, to form an open on the dielectric film above the copper foil circuit.