Semiconductor device

A first wiring part in a first wiring layer is a starting terminal that is connected to a ground potential. The first wiring part and a second wiring part in a second wiring layer are connected by a first connecting part. The second wiring part and a third wiring part in a third wiring layer are con...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: YOSHIDA, TETSUYA, KOIKE, YOSHIHIKO
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A first wiring part in a first wiring layer is a starting terminal that is connected to a ground potential. The first wiring part and a second wiring part in a second wiring layer are connected by a first connecting part. The second wiring part and a third wiring part in a third wiring layer are connected by a second connecting part. A fourth wiring part continuously connected with the third wiring part and a fifth wiring part in the second wiring layer are connected by a third connecting part. The fifth wiring part and a sixth wiring part in the first wiring layer are connected by a fourth connecting part. A conducting path that is continuously connected from the starting terminal to an output end is formed by connecting a mound-shaped conducting path thus formed.