Heat stable photocurable resin composition for dry film resist

The invention relates to a process for preparing a dry film resist by forming a photocurable resin composition onto a support film with a thickness of 1 to 50 mum and optionally laminate a protective film onto the photocurable composition layer to obtain a dry film resist; whereby the photocurable r...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: OKA, HIDETAKA, TAYLOR, JAMES PHILIP, OHWA, MASAKI
Format: Patent
Sprache:eng
Schlagworte:
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