Composition and method for temporarily fixing solid

The present invention is related to a method of temporarily fixing two solid bodies. In the invented method, two solid bodies are mutually and temporarily fixed through the use of liquid crystal compound or the composition containing liquid crystal compound. The invented method can be used in the ex...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: HANAMURA, MASAAKI, YOKOYAMA, YASUAKI, BESSHO, NOBUO
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The present invention is related to a method of temporarily fixing two solid bodies. In the invented method, two solid bodies are mutually and temporarily fixed through the use of liquid crystal compound or the composition containing liquid crystal compound. The invented method can be used in the example such as temporarily fixing method of the filler for CMP where the wafer for semiconductor device is fixed to perform the polishing process when one solid body is used as the filler for chemical mechanical polishing (CMP) of wafer for semiconductor device and the other solid body is used as the disc for fixing.