Lead frame base package structure with high-density of foot prints arrangement

A lead frame base package structure with high-density of foot prints arrangement is formed. The lead frame structure includes a die, a plurality of first foot prints and a plurality of second foot prints, wherein the first foot prints and the second foot prints are posited on at least one side of the die, and are electrically connected to the die. The first foot prints and the second foot prints are selected from a group consisting of J-leads, L-leads and I-leads, and terminals of the first foot prints and terminals of the second foot prints are staggered so that the high-density of foot prints arrangement is formed without risking a short circuit.