Fluid ejection device and method of manufacturing a fluid ejection device
A mold (40) configured to be coupled to a fluid ejection head die (30) to allow a protective material (38) to be molded around a plurality of contact pads (34) on the die (30) is disclosed. The mold (40) includes a molding surface (43) configured to cover the contact pads (34), wherein the molding s...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | A mold (40) configured to be coupled to a fluid ejection head die (30) to allow a protective material (38) to be molded around a plurality of contact pads (34) on the die (30) is disclosed. The mold (40) includes a molding surface (43) configured to cover the contact pads (34), wherein the molding surface (43) is configured to support and shape the protective material (38) during molding, and at least one side (45) extending away from the molding surface (43), wherein the side (45) is configured to contain the protective material (38) during molding. |
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