Method of fabricating printed circuit boards

The present invention relates to a method for fabricating printed circuit boards, wherein the wiring pattern of a printed circuit board is printed on a carrier with the use of adhesive as printing material. After printing the adhesive on the carrier, a main film having releasing metallic film is bon...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	KU, TOM
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	The present invention relates to a method for fabricating printed circuit boards, wherein the wiring pattern of a printed circuit board is printed on a carrier with the use of adhesive as printing material. After printing the adhesive on the carrier, a main film having releasing metallic film is bonded onto the adhesive so that the metallic wiring can be formed on the carrier where the adhesive part of the carrier is adhered to the metallic film, while the non-adhesive part is not adhered to the metallic film. The method of the present invention can simplify the production process of printed circuit boards, and the fabrication of wiring can be performed with relatively high speed, thereby largely increasing the efficiency of the production and reducing the production costs.