Electronic structures with reduced capacitance

An apparatus and method is described incorporating one or more layers of SiCOH and one or more layers of patterned conductors in an integrated circuit chip. The invention overcomes the problem of capacitance by lowering the k of the delectric and overcomes the problem of breakdown voltage and the le...

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Bibliographische Detailangaben
Hauptverfasser: GRILL, ALFRED, GATES, STEPHEN MCCONNELL
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:An apparatus and method is described incorporating one or more layers of SiCOH and one or more layers of patterned conductors in an integrated circuit chip. The invention overcomes the problem of capacitance by lowering the k of the delectric and overcomes the problem of breakdown voltage and the leakage current by tailoring the composition of SiCOH.