Method for fabricating substrate

The present invention provides a method for fabricating a substrate. The method includes providing a mold that having a plurality of pin structures within, a molding process is performed to fill the mold material in the mold, and a mold releasing process is performed to obtain a substrate that having a plurality of through holes and a plurality of hemisphere protruding structures. A conductive material used to conduct the electric circuit through the front side and the back side of the substrate, and the conductive metal layer is composed of a copper layer, a nickel layer, and a gold layer that is formed on the plurality of hemisphere protruding structures sequentially. A plurality of contact pads is formed on the top of the conductor with the through hole on the front side of the substrate. Thus, the contact pad is electrically coupled with the chip that is positioned on the substrate through the conductive wire for the low pin count packaging process.