Film carrier tape for mounting electronic parts and its preparation

The present invention provides a film carrier tape for mounting electronic parts with excellent migration resistance and excellent adhesion between an insulating film and a wiring and its preparation. A seed layer 16 disposed on the film carrier tape for mounting electronic parts of the present inve...

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Bibliographische Detailangaben
Hauptverfasser:	KATAOKA, TATSUO, AKASHI, YOSHIKAZU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TRANSPORTING
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Beschreibung
Zusammenfassung:	The present invention provides a film carrier tape for mounting electronic parts with excellent migration resistance and excellent adhesion between an insulating film and a wiring and its preparation. A seed layer 16 disposed on the film carrier tape for mounting electronic parts of the present invention (1) includes a tin layer formed on a surface-treated face of an insulating film 12 and a nickel layer formed on the surface of the tin layer, or (2) includes an alloy layer consisting of a certain amount of nickel monomer and tin monomer formed on a surface-treated face of an insulating film 12. Alternatively, the film carrier tape for mounting electronic parts of the present invention (3) is continuously coated with a tin coating containing tin monomer on at least one part of the whole area of the surface of the insulating film 12 from the end side thereof at the width direction of the wire 14.