Method for detecting CMP endpoint in acidic slurries
An apparatus for measuring ammonia gas concentration in an ongoing chemical mechanical polishing (CMP) cycle utilizing an acidic CMP slurry, having the following components: (a) a transferring means to collect a sample of the acidic CMP slurry; (b) a converting means to convert the acidic CMP slurry...
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| creator | BARBEE, STEVEN G LI, LEPING WEI, CONG WANG, XIN-HUI GILHOOLY, JAMES |
| description | An apparatus for measuring ammonia gas concentration in an ongoing chemical mechanical polishing (CMP) cycle utilizing an acidic CMP slurry, having the following components: (a) a transferring means to collect a sample of the acidic CMP slurry; (b) a converting means to convert the acidic CMP slurry to a basic slurry; (c) a measuring means to measure the ammonia gas present in the basic slurry; (d) a detection means to signal the end of an ongoing CMP cycle. |
| format | Patent |
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(b) a converting means to convert the acidic CMP slurry to a basic slurry; (c) a measuring means to measure the ammonia gas present in the basic slurry; (d) a detection means to signal the end of an ongoing CMP cycle.</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; MEASURING ; PERFORMING OPERATIONS ; PHYSICS ; POLISHING ; SEMICONDUCTOR DEVICES ; TESTING ; TRANSPORTING</subject><creationdate>2006</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20061111&DB=EPODOC&CC=TW&NR=I266054B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20061111&DB=EPODOC&CC=TW&NR=I266054B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>BARBEE, STEVEN G</creatorcontrib><creatorcontrib>LI, LEPING</creatorcontrib><creatorcontrib>WEI, CONG</creatorcontrib><creatorcontrib>WANG, XIN-HUI</creatorcontrib><creatorcontrib>GILHOOLY, JAMES</creatorcontrib><title>Method for detecting CMP endpoint in acidic slurries</title><description>An apparatus for measuring ammonia gas concentration in an ongoing chemical mechanical polishing (CMP) cycle utilizing an acidic CMP slurry, having the following components: (a) a transferring means to collect a sample of the acidic CMP slurry; 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(b) a converting means to convert the acidic CMP slurry to a basic slurry; (c) a measuring means to measure the ammonia gas present in the basic slurry; (d) a detection means to signal the end of an ongoing CMP cycle.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MEASURING PERFORMING OPERATIONS PHYSICS POLISHING SEMICONDUCTOR DEVICES TESTING TRANSPORTING |
| title | Method for detecting CMP endpoint in acidic slurries |
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