Method for detecting CMP endpoint in acidic slurries

An apparatus for measuring ammonia gas concentration in an ongoing chemical mechanical polishing (CMP) cycle utilizing an acidic CMP slurry, having the following components: (a) a transferring means to collect a sample of the acidic CMP slurry; (b) a converting means to convert the acidic CMP slurry...

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Bibliographische Detailangaben
Hauptverfasser:	BARBEE, STEVEN G, LI, LEPING, WEI, CONG, WANG, XIN-HUI, GILHOOLY, JAMES
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MEASURING PERFORMING OPERATIONS PHYSICS POLISHING SEMICONDUCTOR DEVICES TESTING TRANSPORTING
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Beschreibung
Zusammenfassung:	An apparatus for measuring ammonia gas concentration in an ongoing chemical mechanical polishing (CMP) cycle utilizing an acidic CMP slurry, having the following components: (a) a transferring means to collect a sample of the acidic CMP slurry; (b) a converting means to convert the acidic CMP slurry to a basic slurry; (c) a measuring means to measure the ammonia gas present in the basic slurry; (d) a detection means to signal the end of an ongoing CMP cycle.