Heat dissipation device

Heat dissipation device

A heat dissipation device includes a plurality of fins connected to each other. Each fin includes a first section with a first surface, a second with a second surface and a connection portion. The first surface is parallel to the second surface. The connection portion connects the first and second s...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: LIU, HSIANGAO
Format: Patent
Sprache:eng
Schlagworte:
CALCULATING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PHYSICS
PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:A heat dissipation device includes a plurality of fins connected to each other. Each fin includes a first section with a first surface, a second with a second surface and a connection portion. The first surface is parallel to the second surface. The connection portion connects the first and second sections and extends along the normal direction thereof. An air passage is formed among the first and second sections and the connection portion, so that an air sequentially passes through the first section, the air passage and the second section.