Hardening device

This invention provides a hardening device for performing hardening treatment in a uniform hardening condition, which can prevent contamination of semiconductor chips from gases generated from bonding material during hardening. There are a plurality of chambers (2) which can accommodate every leadfr...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	SUMIYA, OSAMU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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