Hardening device

This invention provides a hardening device for performing hardening treatment in a uniform hardening condition, which can prevent contamination of semiconductor chips from gases generated from bonding material during hardening. There are a plurality of chambers (2) which can accommodate every leadframe (1) individually. A heating gas is supplied into those chambers (2) and, thus, no matter where the chambers are, the same hardening condition is applied for treatment. This is also applicable for the situation where the bonding material such as thermoset resins can generate gasified gases. Even under such circumstance, the semiconductor chips will not be contaminated by the gasified gases generated from the bonding material of the leadframe (1) accommodated in other chambers (2).