Slicing method of the wafer back surface
A slicing method of the wafer back surface, which comprises the following steps: firstly, combining the front surface of a wafer with a supporting piece, while onto the back of the wafer are disposed with several auxiliary slicing marks; using the slicing equipment to perform slicing operation along...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A slicing method of the wafer back surface, which comprises the following steps: firstly, combining the front surface of a wafer with a supporting piece, while onto the back of the wafer are disposed with several auxiliary slicing marks; using the slicing equipment to perform slicing operation along the auxiliary slicing marks on the back surface of wafer. |
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