Wire bonding device

This invention is provided to make the punch lighter while capillary tube of wire bonding device is dropping. The wire bonding head 10 provides supersonic converter 16 with capillary tube 14 on front end, a pair of piezoelectric component 30, 32 (complementary action stretch driving component) makin...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KONDO, YUTAKA, KYOMASU, RYUICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	This invention is provided to make the punch lighter while capillary tube of wire bonding device is dropping. The wire bonding head 10 provides supersonic converter 16 with capillary tube 14 on front end, a pair of piezoelectric component 30, 32 (complementary action stretch driving component) making the supersonic converter 16 move relative to bond holder 20, and the punch detection sensor 21 and Z motor 22 driving bond holder 20. While one of the piezoelectric components 30, 32 drives along the extending direction, the other follows the compression direction to drive. When the punch detection sensor 21 detects that the capillary tube 14 descends by virtue of Z motor 22 to be in touch with top of semiconductor chip, stop to drive Z motor 22 and use the complementary method to elastically drive piezoelectric components 30, 32 and oscillating supersonic converter 16 for moving capillary tube 14 upward.