Package structure (I) of image sensing device

The present invention relates to a package structure of an image sensing device, including: a substrate having a patterned circuit; a chip stuck on the substrate; a package molded on the substrate; and a transparent lid covered on the package to seal the chip. Each respective contact point outside the photosensitive area in the chip connects the circuit with a metal lead; the package encapsulates the metal leads and the periphery of the chip, and the package has a hollow portion formed therein to correspond to the central photosensitive area; the transparent lid encloses the hollow portion and contains the chip therein to constitute a miniaturized image-sensing device that is easy to be formed and manufactured.