Bonding pads design and application on package

A pattern design of bonding pads is employed on a substrate. Each bonding pad is corresponding to a connecting structure. Before a treatment of high temperature, such as reflow process, some bonding pads and the corresponding connecting structures are arranged in offset position. After reflow, each...

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1. Verfasser:	HU, CHIAIEH
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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