Bonding pads design and application on package
A pattern design of bonding pads is employed on a substrate. Each bonding pad is corresponding to a connecting structure. Before a treatment of high temperature, such as reflow process, some bonding pads and the corresponding connecting structures are arranged in offset position. After reflow, each...
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| Sprache: | eng |
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| Zusammenfassung: | A pattern design of bonding pads is employed on a substrate. Each bonding pad is corresponding to a connecting structure. Before a treatment of high temperature, such as reflow process, some bonding pads and the corresponding connecting structures are arranged in offset position. After reflow, each bonding pad is aligned with the corresponding connecting structure. |
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