Bonding pads design and application on package

Bonding pads design and application on package

A pattern design of bonding pads is employed on a substrate. Each bonding pad is corresponding to a connecting structure. Before a treatment of high temperature, such as reflow process, some bonding pads and the corresponding connecting structures are arranged in offset position. After reflow, each...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: HU, CHIAIEH
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator HU, CHIAIEH
description A pattern design of bonding pads is employed on a substrate. Each bonding pad is corresponding to a connecting structure. Before a treatment of high temperature, such as reflow process, some bonding pads and the corresponding connecting structures are arranged in offset position. After reflow, each bonding pad is aligned with the corresponding connecting structure.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TWI251891BB</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TWI251891BB</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TWI251891BB3</originalsourceid><addsrcrecordid>eNrjZNBzys9LycxLVyhITClWSEktzkzPU0jMS1FILCjIyUxOLMnMz1MAooLE5OzE9FQeBta0xJziVF4ozc2g4OYa4uyhm1qQH59aDFSVmpdaEh8S7mlkamhhaejkZEyEEgCK9CpG</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Bonding pads design and application on package</title><source>esp@cenet</source><creator>HU, CHIAIEH</creator><creatorcontrib>HU, CHIAIEH</creatorcontrib><description>A pattern design of bonding pads is employed on a substrate. Each bonding pad is corresponding to a connecting structure. Before a treatment of high temperature, such as reflow process, some bonding pads and the corresponding connecting structures are arranged in offset position. After reflow, each bonding pad is aligned with the corresponding connecting structure.</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2006</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20060321&amp;DB=EPODOC&amp;CC=TW&amp;NR=I251891B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20060321&amp;DB=EPODOC&amp;CC=TW&amp;NR=I251891B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HU, CHIAIEH</creatorcontrib><title>Bonding pads design and application on package</title><description>A pattern design of bonding pads is employed on a substrate. Each bonding pad is corresponding to a connecting structure. Before a treatment of high temperature, such as reflow process, some bonding pads and the corresponding connecting structures are arranged in offset position. After reflow, each bonding pad is aligned with the corresponding connecting structure.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2006</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNBzys9LycxLVyhITClWSEktzkzPU0jMS1FILCjIyUxOLMnMz1MAooLE5OzE9FQeBta0xJziVF4ozc2g4OYa4uyhm1qQH59aDFSVmpdaEh8S7mlkamhhaejkZEyEEgCK9CpG</recordid><startdate>20060321</startdate><enddate>20060321</enddate><creator>HU, CHIAIEH</creator><scope>EVB</scope></search><sort><creationdate>20060321</creationdate><title>Bonding pads design and application on package</title><author>HU, CHIAIEH</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TWI251891BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2006</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>HU, CHIAIEH</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HU, CHIAIEH</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Bonding pads design and application on package</title><date>2006-03-21</date><risdate>2006</risdate><abstract>A pattern design of bonding pads is employed on a substrate. Each bonding pad is corresponding to a connecting structure. Before a treatment of high temperature, such as reflow process, some bonding pads and the corresponding connecting structures are arranged in offset position. After reflow, each bonding pad is aligned with the corresponding connecting structure.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_TWI251891BB
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Bonding pads design and application on package
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-10T15%3A53%3A29IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=HU,%20CHIAIEH&rft.date=2006-03-21&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETWI251891BB%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true