Adhesive for the integrally molded article of a polybenzimidazole resin and process for the production of integrally molded article using the same

The present invention is to provide an adhesive for the integrally molded article of a polybenzimidazole resin, and a process for producing the integrally molded article with a good yield. An adhesive comprises a polybenzimidazole resin, an epoxy resin, a polyamide resin, a polyimide resin, a polyam...

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Bibliographische Detailangaben
Hauptverfasser:	NIWA, NORIYUKI, AIZAWA, MASAMI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES GENERAL PROCESSES OF COMPOUNDING METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES WORKING-UP
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Beschreibung
Zusammenfassung:	The present invention is to provide an adhesive for the integrally molded article of a polybenzimidazole resin, and a process for producing the integrally molded article with a good yield. An adhesive comprises a polybenzimidazole resin, an epoxy resin, a polyamide resin, a polyimide resin, a polyamide-imide resin, and other resin components. Said adhesive is coated on a polybenzimidazole resin-made part and pressed to form an integrally molded article.