Catalyst-imparting treatment solution and electroless plating method

The present invention provides a catalyst-imparting treatment solution and an electroless plating method that can form a protective film of a phosphorus-containing alloy to protect the surface of copper interconnects of an electronic device without forming voids in the copper interconnects. The cata...

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Bibliographische Detailangaben
Hauptverfasser:	INOUE, HIROAKI, MATSUMOTO, MORIJI, NAKAMURA, KENJI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	The present invention provides a catalyst-imparting treatment solution and an electroless plating method that can form a protective film of a phosphorus-containing alloy to protect the surface of copper interconnects of an electronic device without forming voids in the copper interconnects. The catalyst-imparting treatment solution, for use in a catalyst-imparting pretreatment before carrying out electroless plating of at least part of an electronic device having an embedded copper-interconnect structure using complex compound of a noble metal of group IB or group VIII of the Periodic Table.