Adhering method of conductors and tin-gold solder structure used therein
An adhering method of conductors and tin-gold solder structure used in this method are applied between a photoelectric die and a base. The method includes steps of: forming a tin-gold solder structure consisting of a main layer and an adhesive layer on the base, heating the tin-gold solder structure...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | An adhering method of conductors and tin-gold solder structure used in this method are applied between a photoelectric die and a base. The method includes steps of: forming a tin-gold solder structure consisting of a main layer and an adhesive layer on the base, heating the tin-gold solder structure to a reflow temperature of the adhesive solder to proceed adhesion. In the tin-gold solder structure, the adhesive layer overlies the main layer, the weight ratio of gold to tin in the adhesive layer is less than that in the main layer and the thickness of the adhesive layer is less than that of the main layer. |
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