Method for manufacturing film ball grid array package and structure from the same
A method for manufacturing film ball grid array is disclosed. A substrate strip attaches a die-attaching tape which is attached on die-attaching areas, packaging surrounding areas and orientating areas of the substrate strip. An orientating frame attaches on the die-attaching tape which part is on t...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A method for manufacturing film ball grid array is disclosed. A substrate strip attaches a die-attaching tape which is attached on die-attaching areas, packaging surrounding areas and orientating areas of the substrate strip. An orientating frame attaches on the die-attaching tape which part is on the orientating areas of the substrate strip. Then, a plurality of dice attach on the die-attaching tape, and the die-attaching tape which part is on the packaging surrounding areas of the substrate strip is exposing to the dice. A plurality connecting means connect the dice and the substrate strip, and a molding compound is formed for protecting the dice. |
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