Method for improving coating of photoresist

A method for improving coating of photoresist. A substrate with a trench is provided and then wetted with solvent. A first photoresist layer is formed, filling the trench. Thereafter, the first photoresist layer is baked, which in the first photoresist layer is shrunk during baking, such that the su...

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Hauptverfasser: CHENG, CHUNG-HSIU, WANG, CHUNIEH, GAU, JY-JIE, JANG, BOR-PING, CHENG, SU-JEN
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creator CHENG, CHUNG-HSIU
WANG, CHUNIEH
GAU, JY-JIE
JANG, BOR-PING
CHENG, SU-JEN
description A method for improving coating of photoresist. A substrate with a trench is provided and then wetted with solvent. A first photoresist layer is formed, filling the trench. Thereafter, the first photoresist layer is baked, which in the first photoresist layer is shrunk during baking, such that the surface of the baked first photoresist layer is under the surface of the substrate, followed by the ashing to improve the adhesion between the first photoresist layer and the subsequent photoresist layer. Finally, the second photoresist layer is formed over the first photoresist layer to avoid deformation of photoresist during subsequent baking process.
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language eng
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subjects APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CINEMATOGRAPHY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SEMICONDUCTOR DEVICES
title Method for improving coating of photoresist
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