Semiconductor package with leads in different wire-bonding planes

A semiconductor package with leads in different wire-bonding planes includes a chip encapsulated by a package body. A plurality of first leads and a plurality of second leads are staggered around the chip. Wherein, each of the second leads has a connecting finger protruded from the first leads. The second leads are bent so that connecting fingers of the second leads are formed on a wiring-bonding plane different from that of connecting fingers of the first leads formed on. A plurality of first wires and a plurality of second wires respectively connect the connecting fingers of the first leads and the connecting fingers of the second leads to the chip in different loop heights. The wires will not be wire-swept during formation of the package body.